Techvalley participated in NEPCON ASIA 2026, held in Shenzhen, China, from
October 27 to 29, 2026.

At this exhibition, Techvalley’s Chinese subsidiary showcased X-ray inspection images of various
samples from the electronics manufacturing industry, including PCB, SMT, and semiconductor
packaging. Through real-world inspection cases, Techvalley introduced its technologies for analyzing
internal structures and detecting defects, attracting considerable interest from global electronics
industry professionals and visitors.

As the electronics manufacturing industry continues to advance rapidly with a focus on artificial
intelligence (AI), smart factories, and automation solutions, the importance of X-ray inspection
technology is growing. Techvalley highlighted its technological capabilities and competitive strengths
by presenting inspection technologies and solutions applicable to a wide range of industrial sectors.

Through its participation in this exhibition, Techvalley further strengthened its position in the Chinese
X-ray market and expanded opportunities for collaboration with customers across various industries.

Techvalley will continue to advance its technologies and expand its global presence, contributing to
the advancement of the electronics manufacturing industry and innovation in smart manufacturing.